ASAP Defense Parts is a streamlined procurement platform for those seeking in-demand NSN parts, military and defense parts, aerospace parts, and other comparable items. We appreciate your interest in part number F17006404, a Wespercorp Fsg Inc product that is listed alongside the description “Microcircuit Memory” and the NSN 5962012592035. You are always welcome to request quotes for part number F17006404 by filling out and submitting the RFQ form below, and we promise swift responses with customized solutions provided in 15 minutes or less from the review of a completed form.
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For your convenience, we list items like Wespercorp Fsg Inc part number F17006404 with all relevant designations. For example, while part number F17006404 belongs to NSN 5962-01-259-2035, it is also categorized under FSC 5962 Microcircuits Electronic, a commodity classification designation that organizes similar products together. Moreover, in contrast to other websites that often require one to choose between quality, pricing, and timely fulfillment, we routinely utilize our market expertise and purchasing power to present optimal solutions that cater to the unique specifications of each customer. With all of this in mind, begin the procurement process for part number F17006404 from CAGE Code 6Z076 on our website, and see why so many customers steadily depend on us for their needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-259-2035 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012592035 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| HM6264LP-12 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.400 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.594 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.280 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 4.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | LOW POWER AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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