ASAP Defense Parts is a streamlined procurement platform for those seeking in-demand NSN parts, military and defense parts, aerospace parts, and other comparable items. We appreciate your interest in part number WS57C291B-45TMB, a Waferscale Integration Inc product that is listed alongside the description “Microcircuit Memory” and the NSN 5962013544135. You are always welcome to request quotes for part number WS57C291B-45TMB by filling out and submitting the RFQ form below, and we promise swift responses with customized solutions provided in 15 minutes or less from the review of a completed form.
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For your convenience, we list items like Waferscale Integration Inc part number WS57C291B-45TMB with all relevant designations. For example, while part number WS57C291B-45TMB belongs to NSN 5962-01-354-4135, it is also categorized under FSC 5962 Microcircuits Electronic, a commodity classification designation that organizes similar products together. Moreover, in contrast to other websites that often require one to choose between quality, pricing, and timely fulfillment, we routinely utilize our market expertise and purchasing power to present optimal solutions that cater to the unique specifications of each customer. With all of this in mind, begin the procurement process for part number WS57C291B-45TMB from CAGE Code 66579 on our website, and see why so many customers steadily depend on us for their needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-354-4135 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013544135 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5962-8765004LX | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 550.0 MILLIWATTS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS |
| CZER | MEMORY DEVICE TYPE | EPROM |
| FEAT | SPECIAL FEATURES | 2K X 8UV ERASABLE PROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND PROGRAMMED AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
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