ASAP Defense Parts is a streamlined procurement platform for those seeking in-demand NSN parts, military and defense parts, aerospace parts, and other comparable items. We appreciate your interest in part number PC73618, a Rockwell Collins Aerospace product that is listed alongside the description “Microcircuitmemory” and the NSN 5962011284485. You are always welcome to request quotes for part number PC73618 by filling out and submitting the RFQ form below, and we promise swift responses with customized solutions provided in 15 minutes or less from the review of a completed form.
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For your convenience, we list items like Rockwell Collins Aerospace part number PC73618 with all relevant designations. For example, while part number PC73618 belongs to NSN 5962-01-128-4485, it is also categorized under FSC 5962 Microcircuits Electronic, a commodity classification designation that organizes similar products together. Moreover, in contrast to other websites that often require one to choose between quality, pricing, and timely fulfillment, we routinely utilize our market expertise and purchasing power to present optimal solutions that cater to the unique specifications of each customer. With all of this in mind, begin the procurement process for part number PC73618 from CAGE Code 09344 on our website, and see why so many customers steadily depend on us for their needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-128-4485 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011284485 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| PC73618 | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.930 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.200 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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