ASAP Defense Parts is a streamlined procurement platform for those seeking in-demand NSN parts, military and defense parts, aerospace parts, and other comparable items. We appreciate your interest in part number IDT71256S45L32B, a Integrated Device Technology Inc product that is listed alongside the description “Microcircuit Memory” and the NSN 5962013305523. You are always welcome to request quotes for part number IDT71256S45L32B by filling out and submitting the RFQ form below, and we promise swift responses with customized solutions provided in 15 minutes or less from the review of a completed form.
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For your convenience, we list items like Integrated Device Technology Inc part number IDT71256S45L32B with all relevant designations. For example, while part number IDT71256S45L32B belongs to NSN 5962-01-330-5523, it is also categorized under FSC 5962 Microcircuits Electronic, a commodity classification designation that organizes similar products together. Moreover, in contrast to other websites that often require one to choose between quality, pricing, and timely fulfillment, we routinely utilize our market expertise and purchasing power to present optimal solutions that cater to the unique specifications of each customer. With all of this in mind, begin the procurement process for part number IDT71256S45L32B from CAGE Code 61772 on our website, and see why so many customers steadily depend on us for their needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-330-5523 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013305523 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| EDI8832C45CB | 2 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| ADAU | BODY HEIGHT | 0.074 INCHES MINIMUM AND 0.086 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND STATIC OPERATION |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAT | BODY WIDTH | 0.542 INCHES MINIMUM AND 0.558 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
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